Created by plating copper onto a rotating drum. These are further classified by surface profile (e.g., standard, low-profile, high-temperature, and high-elongation).
The document is developed and maintained by the under the Printed Board Base Materials Committee (3‑10) of IPC—the Association Connecting Electronics Industries. It supersedes older standards including IPC‑MF‑150F and IPC‑4562 from May 2000.
High-temperature elongation (HTE) ED copper (critical for multi-layer boards to prevent inner-layer cracking during thermal cycling). Grade 7: Wrought rolled-annealed (RA) copper. Thickness and Weight Nomenclature ipc-4562 pdf
To comply with IPC-4562, metal foils must undergo strict testing and meet specific criteria across several key properties:
Potential areas for future amendments or a Revision C include: Created by plating copper onto a rotating drum
| | Title | Relationship to IPC-4562 | |--------------|-----------|----------------------------| | IPC-4101 | Base Materials for Rigid and Multilayer PCBs | Defines the laminate materials to which the metal foil is bonded | | IPC-4202 | Flexible Base Materials | Specifies the flexible dielectric materials for use with IPC-4562 foils in FPCs | | IPC-6012 | Rigid PCB Qualification and Performance | References IPC-4562 foils as part of the qualification process | | IPC-2221 | Generic PCB Design Standard | Provides design rules that reference IPC-4562 foil properties |
Minimal roughness, crucial for high-speed digital and RF applications to minimize signal loss. Thickness and Weight Nomenclature To comply with IPC-4562,
– As a US‑based national standards body, ANSI sells the same official IPC‑4562B document (ANSI‑approved version).